Connectivity
Explosive growth in the market for consumer electronic devices with more integrated capabilities, larger feature set, higher performance, longer battery life, and lower cost is likely to continue over the next several years. Developers need IP solutions that are high quality and flexible with low power dissipation and compact area. With the increase in complexity required to implement modern, multi-function SoCs, the integration effort is a major bottleneck.
With this in mind, MIPS Technologies has developed, and is continuously expanding its embedded peripheral solutions. MIPS offers a combination of hard IP, soft IP and firmware that isolates complexity and mitigates the risk of integrating advanced connectivity solutions including USB Interfaces (USB link controllers + USB PHY), multimedia interfaces and mobile interfaces. Backed by a dedicated team that works closely with customers to support the development process from evaluation to production, MIPS Technologies offers an ever-expanding portfolio of silicon-proven and certified IP for a broad range of applications, including mobile phones, portable media players, digital still cameras, game consoles and set-top boxes.
MIPS Technologies has more than 80 USB customers worldwide and more than 30 USB2.0 certified products in mass production. More than 200 million chips have been produced with its USB 2.0 solutions. MIPS was first in the market to certify USB IP in TSMC 65LP, and was also first to launch a USB OTG controller, USB using 2.5V transistors, an HSIC PHY and an LPM controller.
TECHNOLOGY HIGHLIGHTS
- USB interfaces: complete solutions including USB link controllers, physical layers (PHY) and sample software, with new versions supporting link power management and high-speed inter-chip USB; the broadest portfolio of USB PHY in all major foundries and processes, from 180nm down to 40nm, with different process flavors; link controllers available as RTL source code in different flavors
- Multimedia interfaces: complete HDMI 1.3 solution for both transmit and receive applications with optional HDCP support; dedicated mobile version for HDMI transmitter functions and optimized power consumption; available now in 65nm and soon to be available in 90nm and 45nm
- Mobile interfaces: 3G DigRF implemented; currently developing DSI, CSI and 4G DigRF
- PLL for clock multiplication, featuring silicon-proven designs with output frequencies up to
1 GHz and beyond, with reduced output jitter as low as 5ps; in technology nodes down to 40nm - LVDS solutions for transmission of video data to LCDs and other digital displays; LVDS serializer, de-serializer, drivers and receivers with flexible parameters, including multiple channels, variable color depth, and high transmission throughput up to 1Gbps per channel
